Bus Driver, LVC/LCX/Z Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 0.65 MM PITCH, SSOP-24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | SSOP |
package instruction | 0.65 MM PITCH, SSOP-24 |
Contacts | 24 |
Reach Compliance Code | not_compliant |
Other features | WITH CLEAR AND PRESET |
series | LVC/LCX/Z |
JESD-30 code | R-PDSO-G24 |
JESD-609 code | e0 |
length | 8.2 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.024 A |
Humidity sensitivity level | 1 |
Number of digits | 9 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 24 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SSOP |
Encapsulate equivalent code | SSOP24,.3 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Prop。Delay @ Nom-Sup | 6.7 ns |
propagation delay (tpd) | 8.6 ns |
Certification status | Not Qualified |
Maximum seat height | 2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 20 |
width | 5.3 mm |
IDT74LVC843APY | IDT74LVC843ASO | IDT74LVC843APG | IDT74LVC843AQ | |
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Description | Bus Driver, LVC/LCX/Z Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 0.65 MM PITCH, SSOP-24 | Bus Driver, LVC/LCX/Z Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 1.27 MM PITCH, SOIC-24 | Bus Driver, LVC/LCX/Z Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 0.65 MM PITCH, TSSOP-24 | Bus Driver, LVC/LCX/Z Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 0.635 MM PITCH, QSOP-24 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Parts packaging code | SSOP | SOIC | TSSOP | SOIC |
package instruction | 0.65 MM PITCH, SSOP-24 | 1.27 MM PITCH, SOIC-24 | 0.65 MM PITCH, TSSOP-24 | 0.635 MM PITCH, QSOP-24 |
Contacts | 24 | 24 | 24 | 24 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
Other features | WITH CLEAR AND PRESET | WITH CLEAR AND PRESET | WITH CLEAR AND PRESET | WITH CLEAR AND PRESET |
series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 8.2 mm | 15.4 mm | 7.8 mm | 8.65 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
Humidity sensitivity level | 1 | 1 | 1 | 1 |
Number of digits | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 2 | 2 | 2 | 2 |
Number of terminals | 24 | 24 | 24 | 24 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | TRUE | TRUE | TRUE | TRUE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SSOP | SOP | TSSOP | SSOP |
Encapsulate equivalent code | SSOP24,.3 | SOP24,.4 | TSSOP24,.25 | SSOP24,.24 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | 240 | 225 | 240 | NOT SPECIFIED |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Prop。Delay @ Nom-Sup | 6.7 ns | 6.7 ns | 6.7 ns | 6.7 ns |
propagation delay (tpd) | 8.6 ns | 8.6 ns | 8.6 ns | 8.6 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2 mm | 2.65 mm | 1.2 mm | 1.75 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 1.27 mm | 0.65 mm | 0.635 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 20 | 30 | 30 | NOT SPECIFIED |
width | 5.3 mm | 7.5 mm | 4.4 mm | 3.9116 mm |