HYS64T512020EU-25F-A datasheet, PDF

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HYS64T512020EU-25F-A: DescriptionDDR DRAM Module, 512MX64, 0.4ns, CMOS, GREEN, UDIMM-240; Categorystorage storage; File Size2MB，41 Pages; ManufacturerQIMONDA; Environmental Compliance

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HYS64T512020EU-25F-A Overview

DDR DRAM Module, 512MX64, 0.4ns, CMOS, GREEN, UDIMM-240

HYS64T512020EU-25F-A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	QIMONDA
Parts packaging code	DIMM
package instruction	DIMM, DIMM240,40
Contacts	240
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	0.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	400 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N240
memory density	34359738368 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	240
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	55 °C
Minimum operating temperature
organize	512MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM240,40
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.256 A
Maximum slew rate	1.87 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1 mm
Terminal location	DUAL

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Description	DDR DRAM Module, 512MX64, 0.4ns, CMOS, GREEN, UDIMM-240	DDR DRAM Module, 512MX72, 0.4ns, CMOS, GREEN, UDIMM-240	DDR DRAM Module, 512MX72, 0.4ns, CMOS, GREEN, UDIMM-240	DDR DRAM Module, 512MX64, 0.4ns, CMOS, GREEN, UDIMM-240	DDR DRAM Module, 512MX64, 0.45ns, CMOS, GREEN, UDIMM-240	DDR DRAM Module, 512MX72, 0.45ns, CMOS, GREEN, UDIMM-240
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM240,40	DIMM, DIMM240,40	DIMM, DIMM240,40	DIMM, DIMM240,40	DIMM, DIMM240,40	DIMM, DIMM240,40
Contacts	240	240	240	240	240	240
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	0.4 ns	0.4 ns	0.4 ns	0.4 ns	0.45 ns	0.45 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	400 MHz	400 MHz	400 MHz	400 MHz	333 MHz	333 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
memory density	34359738368 bit	38654705664 bit	38654705664 bit	34359738368 bit	34359738368 bi	38654705664 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	72	72	64	64	72
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	240	240	240	240	240	240
word count	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words
character code	512000000	512000000	512000000	512000000	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	55 °C	55 °C	55 °C	55 °C	55 °C	55 °C
organize	512MX64	512MX72	512MX72	512MX64	512MX64	512MX72
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM240,40	DIMM240,40	DIMM240,40	DIMM240,40	DIMM240,40	DIMM240,40
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192	8192	8192
self refresh	YES	YES	YES	YES	YES	YES
Maximum slew rate	1.87 mA	2.11 mA	2.11 mA	1.87 mA	1.73 mA	1.944 mA
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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