Microprocessor, 16-Bit, 12.5MHz, CMOS, PQCC68, PLASTIC, LCC-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Intel |
Parts packaging code | LCC |
package instruction | QCCJ, LDCC68,1.0SQ |
Contacts | 68 |
Reach Compliance Code | unknown |
Address bus width | 24 |
bit size | 16 |
boundary scan | NO |
maximum clock frequency | 12.5 MHz |
External data bus width | 16 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | S-PQCC-J68 |
JESD-609 code | e0 |
length | 24.2 mm |
low power mode | YES |
Number of terminals | 68 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.83 mm |
speed | 12.5 MHz |
Maximum slew rate | 125 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 24.2 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
N80C286 | A80C286 | |
---|---|---|
Description | Microprocessor, 16-Bit, 12.5MHz, CMOS, PQCC68, PLASTIC, LCC-68 | Microprocessor, 16-Bit, 12.5MHz, CMOS, CPGA68, PGA-68 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Intel | Intel |
Parts packaging code | LCC | PGA |
package instruction | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 |
Contacts | 68 | 68 |
Reach Compliance Code | unknown | compliant |
Address bus width | 24 | 24 |
bit size | 16 | 16 |
boundary scan | NO | NO |
maximum clock frequency | 12.5 MHz | 12.5 MHz |
External data bus width | 16 | 16 |
Format | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO |
JESD-30 code | S-PQCC-J68 | S-CPGA-P68 |
JESD-609 code | e0 | e0 |
length | 24.2 mm | 29.46 mm |
low power mode | YES | YES |
Number of terminals | 68 | 68 |
Maximum operating temperature | 85 °C | 85 °C |
Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCJ | PGA |
Encapsulate equivalent code | LDCC68,1.0SQ | PGA68,11X11 |
Package shape | SQUARE | SQUARE |
Package form | CHIP CARRIER | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 4.83 mm | 4.57 mm |
speed | 12.5 MHz | 12.5 MHz |
Maximum slew rate | 125 mA | 125 mA |
Maximum supply voltage | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V |
surface mount | YES | NO |
technology | CMOS | CMOS |
Temperature level | OTHER | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | PIN/PEG |
Terminal pitch | 1.27 mm | 2.54 mm |
Terminal location | QUAD | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 24.2 mm | 29.46 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR |