Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon, GLASS HERMETIC DO-41, 2PIN
Parameter Name | Attribute value |
Maker | Microsemi |
Parts packaging code | DO-41 |
package instruction | GLASS HERMETIC DO-41, 2PIN |
Contacts | 2 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Shell connection | ISOLATED |
Configuration | SINGLE |
Diode component materials | SILICON |
Diode type | RECTIFIER DIODE |
JESD-30 code | O-LALF-W2 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 2 |
Maximum operating temperature | 175 °C |
Minimum operating temperature | -55 °C |
Maximum output current | 1 A |
Package body material | GLASS |
Package shape | ROUND |
Package form | LONG FORM |
Certification status | Not Qualified |
Maximum repetitive peak reverse voltage | 100 V |
Maximum reverse recovery time | 0.03 µs |
surface mount | NO |
Terminal surface | TIN LEAD |
Terminal form | WIRE |
Terminal location | AXIAL |
UGF110 | UGF115 | |
---|---|---|
Description | Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon, GLASS HERMETIC DO-41, 2PIN | Rectifier Diode, 1 Element, 1A, 150V V(RRM), Silicon, GLASS HERMETIC DO-41, 2PIN |
Maker | Microsemi | Microsemi |
Parts packaging code | DO-41 | DO-41 |
package instruction | GLASS HERMETIC DO-41, 2PIN | O-LALF-W2 |
Contacts | 2 | 2 |
Reach Compliance Code | unknown | compliant |
ECCN code | EAR99 | EAR99 |
Shell connection | ISOLATED | ISOLATED |
Configuration | SINGLE | SINGLE |
Diode component materials | SILICON | SILICON |
Diode type | RECTIFIER DIODE | RECTIFIER DIODE |
JESD-30 code | O-LALF-W2 | O-LALF-W2 |
JESD-609 code | e0 | e0 |
Number of components | 1 | 1 |
Number of terminals | 2 | 2 |
Maximum operating temperature | 175 °C | 175 °C |
Minimum operating temperature | -55 °C | -55 °C |
Maximum output current | 1 A | 1 A |
Package body material | GLASS | GLASS |
Package shape | ROUND | ROUND |
Package form | LONG FORM | LONG FORM |
Certification status | Not Qualified | Not Qualified |
Maximum repetitive peak reverse voltage | 100 V | 150 V |
Maximum reverse recovery time | 0.03 µs | 0.03 µs |
surface mount | NO | NO |
Terminal surface | TIN LEAD | TIN LEAD |
Terminal form | WIRE | WIRE |
Terminal location | AXIAL | AXIAL |