Microprocessor, 32-Bit, 10MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64
| Parameter Name | Attribute value |
| Maker | Atmel (Microchip) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 64 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Address bus width | 24 |
| bit size | 32 |
| boundary scan | NO |
| maximum clock frequency | 10 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-CDIP-T64 |
| length | 81.28 mm |
| low power mode | NO |
| Number of terminals | 64 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 4.83 mm |
| speed | 10 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | HCMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 22.86 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
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