FIFO, 128KX9, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | QFP |
| package instruction | 10 X 10 MM, TQFP-64 |
| Contacts | 64 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 10 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 66 MHz |
| period time | 15 ns |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e0 |
| length | 10 mm |
| memory density | 1179648 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 128KX9 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Encapsulate equivalent code | QFP64,.47SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.045 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 10 mm |
| CY7C4292-15ASI | CY7C4282-25ASI | CY7C4282-15ASI | CY7C4292-25ASI | |
|---|---|---|---|---|
| Description | FIFO, 128KX9, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 | FIFO, 64KX9, 15ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 | FIFO, 64KX9, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 | FIFO, 128KX9, 15ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | QFP | QFP | QFP | QFP |
| package instruction | 10 X 10 MM, TQFP-64 | 10 X 10 MM, TQFP-64 | 10 X 10 MM, TQFP-64 | 10 X 10 MM, TQFP-64 |
| Contacts | 64 | 64 | 64 | 64 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 10 ns | 15 ns | 10 ns | 15 ns |
| Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| Maximum clock frequency (fCLK) | 66 MHz | 40 MHz | 66 MHz | 40 MHz |
| period time | 15 ns | 25 ns | 15 ns | 25 ns |
| JESD-30 code | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 10 mm | 10 mm | 10 mm | 10 mm |
| memory density | 1179648 bit | 589824 bit | 589824 bit | 1179648 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 64 | 64 | 64 | 64 |
| word count | 131072 words | 65536 words | 65536 words | 131072 words |
| character code | 128000 | 64000 | 64000 | 128000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 128KX9 | 64KX9 | 64KX9 | 128KX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFQFP | LFQFP | LFQFP | LFQFP |
| Encapsulate equivalent code | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.47SQ,20 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | NOT SPECIFIED | 240 |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | 30 | NOT SPECIFIED | 30 |
| width | 10 mm | 10 mm | 10 mm | 10 mm |
| Maker | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor |
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