Memory Circuit, Flash+SDRAM, PBGA107
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Micron Technology |
| package instruction | FBGA, BGA107,10X14,32 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-PBGA-B107 |
| Memory IC Type | MEMORY CIRCUIT |
| Mixed memory types | FLASH+SDRAM |
| Number of terminals | 107 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -30 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA107,10X14,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, FINE PITCH |
| power supply | 1.8 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
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