AM27X040-150EC datasheet, PDF - EEWORLD Datasheet

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AM27X040-150EC: DescriptionMASK ROM, 512KX8, 150ns, CMOS, PDSO32, TSOP-32; Categorystorage storage; File Size79KB，10 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27X040-150EC Overview

MASK ROM, 512KX8, 150ns, CMOS, PDSO32, TSOP-32

AM27X040-150EC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	TSOP
package instruction	TSOP1, TSSOP32,.8,20
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	18.4 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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FINAL

Am27X040

4 Megabit (524,288 x 8-Bit) CMOS ExpressROM Device

DISTINCTIVE CHARACTERISTICS

As an OTP EPROM alternative:

— Factory optimized programming

— Fully tested and guaranteed

As a Mask ROM alternative:

— Shorter leadtime

— Lower volume per code

Fast access time

— 90 ns

Single +5 V power supply

Compatible with JEDEC-approved EPROM

pinout

±10%

power supply tolerance

High noise immunity

Low power dissipation

Advanced

Micro

Devices

— 100

µA

maximum CMOS standby current

Available in Plastic Dual In-Line Pack-

age (PDIP), Plastic Leaded Chip Carrier (PLCC),

and Thin Small Outline Package (TSOP)

Latch-up protected to 100 mA from –1 V to

+1 V

Versatile features for simple interfacing

—

Both CMOS and TTL input/output compatibility

— Two line control functions

GENERAL DESCRIPTION

The Am27X040 is a factory programmed and tested

OTP EPROM. It is programmed after packaging prior to

final test. Every device is rigorously tested under AC and

DC operating conditions to your stable code. It is organ-

ized as 524,288 by 8 bits and is available in plastic dual

in-line (PDIP), plastic leaded chip carrier (PLCC), and

thin small outline (TSOP) packages. ExpressROM de-

vices provide a board-ready memory solution for me-

dium to high volume codes with short leadtimes. This

offers manufacturers a cost-effective and flexible alter-

native to OTP EPROMs and mask programmed ROMs.

Access times as fast as 90 ns allow operation with high-

performance microprocessors with reduced WAIT

states. The Am27X040 offers separate Output Enable

(OE) and Chip Enable (CE) controls, thus eliminating

bus contention in a multiple bus microprocessor system.

AMD’s CMOS process technology provides high speed,

low power, and high noise immunity. Typical power con-

sumption is only 100 mW in active mode, and 100

µW

standby mode.

BLOCK DIAGRAM

VCC

VSS

VPP

Output Enable

Chip Enable

Data Outputs

DQ0–DQ7

Output

Buffers

Decoder

A0–A18

Address

Inputs

Gating

Decoder

4,194,304-Bit

Cell Matrix

15654C-1

Publication#

15654

Rev.

Issue Date:

May 1995

Amendment

4-85

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