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CY7C15632KV18-550BZC

Description
QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Categorystorage    storage   
File Size559KB,22 Pages
ManufacturerCypress Semiconductor
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CY7C15632KV18-550BZC Overview

QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

CY7C15632KV18-550BZC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeBGA
package instruction13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time0.45 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)550 MHz
I/O typeSEPARATE
JESD-30 codeR-PBGA-B165
length15 mm
memory density75497472 bit
Memory IC TypeQDR SRAM
memory width18
Number of functions1
Number of terminals165
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
power supply1.5/1.8,1.8 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum standby current0.38 A
Minimum standby current1.7 V
Maximum slew rate0.92 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm
CY7C15632KV18
72-Mbit QDR
®
II+ SRAM 4-Word Burst
Architecture (2.5 Cycle Read Latency)
Features
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C15632KV18 – 4M x 18
Separate Independent Read and Write Data Ports
Supports concurrent transactions
550 MHz Clock for High Bandwidth
4-word Burst for Reducing Address Bus Frequency
Double Data Rate (DDR) Interfaces on both Read and Write
Ports (data transferred at 1100 MHz) at 550 MHz
Available in 2.5 Clock Cycle Latency
Two Input Clocks (K and K) for precise DDR Timing
SRAM uses rising edges only
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed
Systems
Data Valid Pin (QVLD) to indicate Valid Data on the Output
Single Multiplexed Address Input Bus latches Address Inputs
for Read and Write Ports
Separate Port selects for Depth Expansion
Synchronous Internally Self-timed Writes
QDR
®
II+ operates with 2.5 cycle read latency when DOFF is
asserted HIGH
Operates similar to QDR I Device with one Cycle Read Latency
when DOFF is asserted LOW
Available in x18 Configuration
Full Data Coherency, providing Most Current Data
Core V
DD
= 1.8V± 0.1V; I/O V
DDQ
= 1.4V to V
DD [1]
Supports both 1.5V and 1.8V I/O supply
HSTL Inputs and Variable Drive HSTL Output Buffers
Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free Packages
JTAG 1149.1 compatible Test Access Port
Phase-Locked Loop (PLL) for Accurate Data Placement
Functional Description
The CY7C15632KV18 is a 1.8V Synchronous Pipelined SRAM,
equipped with QDR II+ architecture. Similar to QDR II archi-
tecture, QDR II+ architecture consists of two separate ports: the
read port and the write port to access the memory array. The
read port has dedicated data outputs to support read operations
and the write port has dedicated data inputs to support write
operations. QDR II+ architecture has separate data inputs and
data outputs to completely eliminate the need to “turnaround” the
data bus that exists with common I/O devices. Each port is
accessed through a common address bus. Addresses for read
and write addresses are latched on alternate rising edges of the
input (K) clock. Accesses to the QDR II+ read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are equipped with DDR
interfaces. Each address location is associated with four 18-bit
words that burst sequentially into or out of the device. Because
data is transferred into and out of the device on every rising edge
of both input clocks (K and K), memory bandwidth is maximized
while simplifying system design by eliminating bus
“turnarounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Table 1. Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
x18
550 MHz
550
920
500 MHz
500
850
450 MHz
450
780
400 MHz
400
710
Unit
MHz
mA
Note
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V
DDQ
= 1.4V to V
DD
.
Cypress Semiconductor Corporation
Document Number: 001-54932 Rev. **
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised July 31, 2009
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Description QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Is it Rohs certified? incompatible conform to conform to
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code BGA BGA BGA
package instruction 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts 165 165 165
Reach Compliance Code compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 0.45 ns 0.45 ns 0.45 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK) 550 MHz 550 MHz 550 MHz
I/O type SEPARATE SEPARATE SEPARATE
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
length 15 mm 15 mm 15 mm
memory density 75497472 bit 75497472 bit 75497472 bit
Memory IC Type QDR SRAM QDR SRAM QDR SRAM
memory width 18 18 18
Number of functions 1 1 1
Number of terminals 165 165 165
word count 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 4MX18 4MX18 4MX18
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA
Encapsulate equivalent code BGA165,11X15,40 BGA165,11X15,40 BGA165,11X15,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 1.5/1.8,1.8 V 1.5/1.8,1.8 V 1.5/1.8,1.8 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm 1.4 mm
Maximum standby current 0.38 A 0.38 A 0.38 A
Minimum standby current 1.7 V 1.7 V 1.7 V
Maximum slew rate 0.92 mA 0.92 mA 0.92 mA
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 13 mm 13 mm 13 mm
JESD-609 code - e1 e1
Humidity sensitivity level - 3 3
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Base Number Matches - 1 1
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