W631GG8KB15A datasheet, PDF - EEWORLD Datasheet

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W631GG8KB15A: DescriptionDDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78; Categorystorage storage; File Size2MB，159 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W631GG8KB15A Overview

DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78

W631GG8KB15A Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
package instruction	TFBGA,
Reach Compliance Code	compliant
access mode	MULTI BANK PAGE BURST
Maximum access time	20 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B78
length	10.5 mm
memory density	1073741824 bit
Memory IC Type	DDR DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	78
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	95 °C
Minimum operating temperature	-40 °C
organize	128MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.2 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

W631GG8KB15A Related Products

	W631GG8KB15A	W631GG8KB15K	W631GG8KB12A	W631GG8KB12K
Description	DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78	DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78	DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78	DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
package instruction	TFBGA,	TFBGA,	TFBGA,	TFBGA,
Reach Compliance Code	compliant	compliant	compli	compli
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Maximum access time	20 ns	20 ns	20 ns	20 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78
length	10.5 mm	10.5 mm	10.5 mm	10.5 mm
memory density	1073741824 bit	1073741824 bit	1073741824 bi	1073741824 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	78	78	78	78
word count	134217728 words	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	95 °C	105 °C	95 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	128MX8	128MX8	128MX8	128MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	8 mm	8 mm	8 mm

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