Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LG Semicon Co., Ltd. |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.006 A |
Number of digits | 6 |
Number of functions | 2 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 38 ns |
Certification status | Not Qualified |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
GD54HC368J | GD74HCT368J | GD74HCT368 | GD74HCT368D | GD74HC368D | GD54HCT368J | GD74HC368J | GD74HC368 | |
---|---|---|---|---|---|---|---|---|
Description | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDSO16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDSO16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16, | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
Number of digits | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
Minimum operating temperature | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | SOP | SOP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 2/6 V | 5 V | 5 V | 5 V | 2/6 V | 5 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 38 ns | 26 ns | 26 ns | 26 ns | 23 ns | 30 ns | 23 ns | 23 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO | YES | YES | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | LG Semicon Co., Ltd. | - | - | - | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | - | DIP, DIP16,.3 |