Flash, 256MX8, 18ns, PDSO48, LEAD FREE, TSOP1-48
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Micron Technology |
Parts packaging code | TSOP1 |
package instruction | TSOP1, |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 18 ns |
JESD-30 code | R-PDSO-G48 |
JESD-609 code | e3 |
length | 18.4 mm |
memory density | 2147483648 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 268435456 words |
character code | 256000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256MX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
type | SLC NAND TYPE |
width | 12 mm |