DDR DRAM, 16MX18, 0.3ns, CMOS, PBGA144, LEAD FREE, FBGA-144
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Micron Technology |
Parts packaging code | BGA |
package instruction | TBGA, BGA144,12X18,40/32 |
Contacts | 144 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | MULTI BANK PAGE BURST |
Maximum access time | 0.3 ns |
Other features | AUTO REFRESH |
Maximum clock frequency (fCLK) | 300 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B144 |
JESD-609 code | e1 |
length | 18.5 mm |
memory density | 301989888 bit |
Memory IC Type | DDR DRAM |
memory width | 18 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
organize | 16MX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Encapsulate equivalent code | BGA144,12X18,40/32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.5/1.8,1.8,2.5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Continuous burst length | 2,4,8 |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 11 mm |