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SN74HC7003N3

Description
IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC
Categorylogic    logic   
File Size81KB,2 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

SN74HC7003N3 Overview

IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC

SN74HC7003N3 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP14,.3
Reach Compliance Codenot_compliant
JESD-30 codeR-PDIP-T14
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Schmitt triggerYES
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SN74HC7003N3 Related Products

SN74HC7003N3 SN74HC7003N SN74HC7003N1 SN74HC7003NP1 SN74HC7003NP3
Description IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-PDIP-T14 R-PDIP-T14 R-PDIP-T14 R-PDIP-T14 R-PDIP-T14
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Schmitt trigger YES YES YES YES YES
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Certification status - Not Qualified Not Qualified Not Qualified -
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