IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-PDIP-T14 |
Logic integrated circuit type | NAND GATE |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Schmitt trigger | YES |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
SN74HC7003N3 | SN74HC7003N | SN74HC7003N1 | SN74HC7003NP1 | SN74HC7003NP3 | |
---|---|---|---|---|---|
Description | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 code | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
Number of terminals | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Schmitt trigger | YES | YES | YES | YES | YES |
surface mount | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | - |