MM74C86W datasheet, PDF - EEWORLD Datasheet

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MM74C86W: DescriptionIC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,FP,14PIN,PLASTIC; Categorylogic logic; File Size160KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MM74C86W Overview

IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,FP,14PIN,PLASTIC

MM74C86W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DFP, FL14,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDFP-F14
JESD-609 code	e0
Logic integrated circuit type	XOR GATE
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DFP
Encapsulate equivalent code	FL14,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5/15 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

MM74C86W Related Products

	MM74C86W	MM54C86J/883C	MM54C86J/883B	MM74C86J/A+	MM74C86N/A+
Description	IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,FP,14PIN,PLASTIC	IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,DIP,14PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DFP, FL14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDFP-F14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	XOR GATE	XOR GATE	XOR GATE	XOR GATE	XOR GATE
Number of terminals	14	14	14	14	14
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DFP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	FL14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Schmitt trigger	NO	NO	NO	NO	NO
surface mount	YES	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-

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