Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | BOARD |
package instruction | ZIP-64 |
Contacts | 64 |
Manufacturer packaging code | ZP64 |
Reach Compliance Code | not_compliant |
Maximum access time | 25 ns |
Other features | WD-MAX |
I/O type | COMMON |
JESD-30 code | R-XZMA-T64 |
JESD-609 code | e0 |
length | 92.71 mm |
memory density | 8388608 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX32 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | ZIP |
Encapsulate equivalent code | ZIP64/68,.1,.1 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 14.859 mm |
Maximum standby current | 0.12 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 1.36 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.27 mm |
Terminal location | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 9.271 mm |