EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

KM44C1000ALZ-8

Description
Fast Page DRAM, 1MX4, 80ns, CMOS, PZIP20, PLASTIC, ZIP-20
Categorystorage    storage   
File Size554KB,17 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM44C1000ALZ-8 Overview

Fast Page DRAM, 1MX4, 80ns, CMOS, PZIP20, PLASTIC, ZIP-20

KM44C1000ALZ-8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeZIP
package instructionZIP, ZIP20,.1
Contacts20
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-PZIP-T20
JESD-609 codee0
length26.165 mm
memory density4194304 bit
Memory IC TypeFAST PAGE DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals20
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeZIP
Encapsulate equivalent codeZIP20,.1
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle1024
Maximum seat height10.16 mm
self refreshNO
Maximum standby current0.0002 A
Maximum slew rate0.095 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch1.27 mm
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED
width2.96 mm

KM44C1000ALZ-8 Related Products

KM44C1000ALZ-8 KM44C1000ALP-7 KM44C1000ALP-8 KM44C1000ALJ-10 KM44C1000ALP-10 KM44C1000ALZ-7 KM44C1000ALJ-8 KM44C1000ALZ-10 KM44C1000ALJ-7
Description Fast Page DRAM, 1MX4, 80ns, CMOS, PZIP20, PLASTIC, ZIP-20 Fast Page DRAM, 1MX4, 70ns, CMOS, PDIP20, PLASTIC, DIP-20 Fast Page DRAM, 1MX4, 80ns, CMOS, PDIP20, PLASTIC, DIP-20 Fast Page DRAM, 1MX4, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 Fast Page DRAM, 1MX4, 100ns, CMOS, PDIP20, PLASTIC, DIP-20 Fast Page DRAM, 1MX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20 Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 Fast Page DRAM, 1MX4, 100ns, CMOS, PZIP20, PLASTIC, ZIP-20 Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, PLASTIC, SOJ-26/20
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code ZIP DIP DIP SOJ DIP ZIP SOJ ZIP SOJ
package instruction ZIP, ZIP20,.1 DIP, DIP20,.3 DIP, DIP20,.3 SOJ, SOJ20/26,.34 DIP, DIP20,.3 ZIP, ZIP20,.1 SOJ, SOJ20/26,.34 ZIP, ZIP20,.1 SOJ, SOJ20/26,.34
Contacts 20 20 20 20 20 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 80 ns 70 ns 80 ns 100 ns 100 ns 70 ns 80 ns 100 ns 70 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PZIP-T20 R-PDIP-T20 R-PDIP-T20 R-PDSO-J20 R-PDIP-T20 R-PZIP-T20 R-PDSO-J20 R-PZIP-T20 R-PDSO-J20
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 26.165 mm 24.56 mm 24.56 mm 17.145 mm 24.56 mm 26.165 mm 17.145 mm 26.165 mm 17.145 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 4 4 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 20 20 20 20 20 20
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code ZIP DIP DIP SOJ DIP ZIP SOJ ZIP SOJ
Encapsulate equivalent code ZIP20,.1 DIP20,.3 DIP20,.3 SOJ20/26,.34 DIP20,.3 ZIP20,.1 SOJ20/26,.34 ZIP20,.1 SOJ20/26,.34
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 1024 1024 1024 1024 1024 1024 1024 1024 1024
Maximum seat height 10.16 mm 4.65 mm 4.65 mm 3.68 mm 4.65 mm 10.16 mm 3.68 mm 10.16 mm 3.68 mm
self refresh NO NO NO NO NO NO NO NO NO
Maximum standby current 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A
Maximum slew rate 0.095 mA 0.105 mA 0.095 mA 0.085 mA 0.085 mA 0.105 mA 0.095 mA 0.085 mA 0.105 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES NO NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE J BEND
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location ZIG-ZAG DUAL DUAL DUAL DUAL ZIG-ZAG DUAL ZIG-ZAG DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 2.96 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 2.96 mm 7.62 mm 2.96 mm 7.62 mm
Maker SAMSUNG - - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Electronic engineers, did you take advantage of yesterday's price war?
[align=left]Yesterday, several groups were discussing the continuous price reduction of double-sided board proofing, from 10 yuan to 5 yuan and then to 3 yuan. Of course, the names of two PCB companie...
肖优秀 Talking about work
Qualcomm launches next-generation cellular chipsets designed for the Internet of Things
Qualcomm Incorporated has announced its next-generation modem for Internet of Things (IoT) applications such as asset trackers, health monitors, security systems, smart city sensors and smart meters, ...
朗锐智科 RF/Wirelessly
IDC: Asia-Pacific packaged software market to grow by double digits again this year
[Abstract] Singapore, January 20, 2005 - According to IDC's recent forecast for the packaged software market, the Asia-Pacific (excluding Japan) packaged software market is expected to grow by 10.8% i...
tmily RF/Wirelessly
Measures for the Administration of Pollution Control of Electronic Information Products
Measures for the Administration of Pollution Control of Electronic Information Products【Source: SMTe website】【Author: Ministry of Information Industry】【Time: 2006-7-6 9:49:51】【Click: 5】Chapter I Gener...
fighting Analog electronics
[Repost] A brief analysis of the three major detection methods for faulty cables
[align=left][color=rgb(25, 25, 25)][font="]The initial detection method of the faulty cable is divided into the loop bridge balance method, the low-voltage pulse reflection method, and the flash teste...
皇华Ameya360 Power technology
Benefits of IoT
Before studying the benefits of IoT, it is important to first understand IoT. In today’s world, there is a lot of buzz about the trending technology IoT (Internet of Things). As the world is becoming ...
btty038 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号