4MX16 FLASH 3V PROM, 70ns, PBGA48, 6.39 X 10.50 MM, 0.75 PITCH, TFBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | BGA |
package instruction | 6.39 X 10.50 MM, 0.75 PITCH, TFBGA-48 |
Contacts | 48 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 70 ns |
Other features | BOTTOM BOOT BLOCK |
startup block | BOTTOM |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e0 |
length | 10.5 mm |
memory density | 67108864 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
width | 6.39 mm |