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AM29BDD160GB-65ADTE1

Description
Flash, 512KX32, 67ns, DIE-76
Categorystorage    storage   
File Size314KB,15 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM29BDD160GB-65ADTE1 Overview

Flash, 512KX32, 67ns, DIE-76

AM29BDD160GB-65ADTE1 Parametric

Parameter NameAttribute value
MakerAMD
Parts packaging codeDIE
package instructionDIE-76
Contacts76
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time67 ns
Other featuresSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Spare memory width16
startup blockBOTTOM
JESD-30 codeR-XUUC-N76
memory density16777216 bit
Memory IC TypeFLASH
memory width32
Number of functions1
Number of terminals76
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize512KX32
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum supply voltage (Vsup)2.75 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.6 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formNO LEAD
Terminal locationUPPER
typeNOR TYPE
SUPPLEMENT
Am29BDD160G Known Good Die—Die Revision 1
16 Megabit (1 M x 16-Bit/512 K x 32-Bit)
CMOS 2.5 Volt-only Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory
DISTINCTIVE CHARACTERISTICS
ARCHITECTURE ADVANTAGES
Ultra low power consumption
— Burst Mode Read: 90 mA @ 56 MHz max
— Program/Erase: 50 mA max
— Standby mode: CMOS: 250 µA max
Simultaneous Read/Write operations
— Data can be continuously read from one bank while
executing erase/program functions in other bank
— Zero latency between read and write operations
— Two bank architecture: 75%/25%
User-Defined x16 or x32 Data Bus
Dual Boot Block
— Top and bottom boot in the same device
Minimum 1 million write cycles guaranteed per sector
20 year data retention at 125°C
VersatileI/O™ control
— Device generates data output voltages and tolerates data
input voltages as determined by the voltage on the V
IO
pin
— 1.65 V to 2.75 V compatible I/O signals
Flexible sector architecture
— Eight 8 Kbytes, thirty 64 Kbytes, and eight 8 Kbytes
sectors
SOFTWARE FEATURES
Manufactured on 0.17 µm process technology
SecSi (Secured Silicon) Sector (256 Bytes)
Factory locked and identifiable:
16 bytes for secure,
random factory Electronic Serial Number; remainder may
be customer data programmed by AMD
Customer lockable:
Can be read, programmed or erased
just like other sectors. Once locked, data cannot be
changed
Persistent Sector Protection
— A command sector protection method to lock
combinations of individual sectors and sector groups to
prevent program or erase operations within that sector
(requires only V
CC
levels)
Password Sector Protection
— A sophisticated sector protection method to lock
combinations of individual sectors and sector groups to
prevent program or erase operations within that sector
using a user-definable 64-bit password
Programmable Burst interface
— Interface to any high performance processor
— Modes of Burst Read Operation:
Linear Burst:
4 double words (x32), 8 words (x16) and
double words (x32), and 32 words (x16) with wrap
around
Supports Common Flash Interface (CFI)
Unlock Bypass Program Command
— Reduces overall programming time when issuing multiple
program command sequences
Single power supply operation
— Optimized for 2.5 to 2.75 Volt read, erase, and program
operations
Data# Polling and toggle bits
— Provides a software method of detecting program or
erase operation completion
Compatibility with JEDEC standards (JC42.4)
— Software compatible with single-power supply Flash
— Backward-compatible with AMD Am29LV and Am29F
flash memories
HARDWARE FEATURES
Program Suspend/Resume & Erase Suspend/Resume
— Suspends program or erase operations to allow reading,
programming, or erasing in same bank
PERFORMANCE CHARACTERISTICS
Hardware Reset (RESET#), Ready/Busy# (RY/BY#),
and Write Protect (WP#) inputs
ACC input
— Accelerates programming time for higher throughput
during system production
High performance read access
— Initial/random access times as fast as 64 ns
— Burst access time as fast as 10 ns
Quality and reliability levels equivalent to standard
packaged components
Publication#
26994
Rev:
A
Amendment/2
Issue Date:
May 9, 2003

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