Flash, 2MX16, 70ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SPANSION |
| Parts packaging code | BGA |
| package instruction | TFBGA, |
| Contacts | 63 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 70 ns |
| Other features | HARDWARE DATA PROTECTION/RESET PIN, 1 MILLION WRITE CYCLES PER SECTOR, 20 YEAR DATA RETENTION |
| Spare memory width | 8 |
| startup block | BOTTOM |
| Data retention time - minimum | 20 |
| JESD-30 code | R-PBGA-B63 |
| JESD-609 code | e1 |
| length | 14 mm |
| memory density | 33554432 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 63 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| type | NOR TYPE |
| width | 8 mm |
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