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MT58L64L32PF-6

Description
Standard SRAM, 64KX32, 3.5ns, CMOS, PBGA165, FBGA-165
Categorystorage    storage   
File Size648KB,25 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT58L64L32PF-6 Overview

Standard SRAM, 64KX32, 3.5ns, CMOS, PBGA165, FBGA-165

MT58L64L32PF-6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeBGA
package instructionFBGA-165
Contacts165
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Maximum access time3.5 ns
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals165
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.01 A
Minimum standby current3.14 V
Maximum slew rate0.34 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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