CAT1163P-30 datasheet, PDF - EEWORLD Datasheet

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CAT1163P-30: DescriptionMicroprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8; CategoryThe embedded processor and controller Microcontrollers and processors; File Size435KB，14 Pages; ManufacturerCatalyst; Websitehttp://www.catalyst-semiconductor.com/

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CAT1163P-30 Overview

Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8

CAT1163P-30 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Catalyst
Parts packaging code	DIP
package instruction	DIP,
Contacts	8
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.27 mm
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage	6 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

CAT1163P-30 Related Products

	CAT1163P-30	CAT1163PI-30	CAT1163P-45	CAT1163P-28	CAT1163PI-25	CAT1163PI-42	CAT1163PI-45	CAT1163PI-28	CAT1163P-25
Description	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Contacts	8	8	8	8	8	8	8	8	8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	9.27 mm	9.27 mm	9.27 mm	9.27 mm	9.27 mm	9.27 mm	9.27 mm	9.27 mm	9.27 mm
Number of terminals	8	8	8	8	8	8	8	8	8
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C	85 °C	85 °C	70 °C
Minimum operating temperature	-	-40 °C	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240	240	240	240
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm
Maximum supply voltage	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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