Res,SMT,Thin Film,95.3K Ohms,150WV,.1% +/-Tol,-5,5ppm TC,2010 Case
Parameter Name | Attribute value |
package instruction | SMT, 2010 |
Reach Compliance Code | unknow |
Other features | HIGH PRECISION |
structure | Rectangul |
JESD-609 code | e0 |
Installation features | SURFACE MOUNT |
Number of terminals | 2 |
Maximum operating temperature | 155 °C |
Minimum operating temperature | -65 °C |
Package height | 1.02 mm |
Package length | 5.72 mm |
Package form | SMT |
Package width | 2.8 mm |
method of packing | Waffle Pack |
Rated power dissipation(P) | 0.5 W |
Rated temperature | 70 °C |
Guideline | ESCC4001/023 |
resistance | 95300 Ω |
Resistor type | FIXED RESISTOR |
size code | 2010 |
surface mount | YES |
technology | THIN FILM |
Temperature Coefficient | 5 ppm/°C |
Terminal surface | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrie |
Terminal shape | WRAPAROUND |
Tolerance | 0.1% |
Operating Voltage | 150 V |
Base Number Matches | 1 |