Release
by
PARALIGHTDCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan,
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: para@para.com.tw
DATA SHEET
PART NO. : C-391G B/W
REV :
A/0
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-11-12-0204G
DCC : ____________
Page : 1
DATE : 2012-10-15
Release
by
PARALIGHTDCC
0.39
INCH SINGLE DIGIT DISPLAY
C-391G B/W
REV:A / 0
PACKAGE DIMENSIONS
NOTES : 1. All dimensions are in millimeters. (inches)
2. Tolerance is
±
0.25(0.010") unless otherwise specified.
3. Pls. contact with us when your production need to be
operated under the Pb free process.
DRAWING NO. : DS-11-12-0204G
DATE : 2012-10-15
Page : 2
Release
by
PARALIGHTDCC
0.39
INCH SINGLE DIGIT DISPLAY
C-391G B/W
REV:A / 0
FEATURES
Û
Û
Û
Û
Û
Û
9.95mm (0.39 inch ) DIGIT HEIGHT
COMMON CATHODE
I.C. COMPATIBLE
LOW POWER CONSUMPTION
Pb FREE PRODUCTS
BLACK FACE, WHITE SEGMENTS
Raw Material : GaP/GaP
ABSOLUTE MAXIMUM RATING : ( Ta = 25
℃
SYMBOL
P
D
V
R
I
AF
I
PF
－
Topr
Tstg
PARAMETER
Power Dissipation Per Segment
Reverse Voltage Per Segment
Continuous Forward Current Per Segment
Peak Forward Current Per Segment
(1/10 Duty Cycle,0.1ms Pulse Width)
Derating Linear From 25℃ Per Segment
Operating Temperature Range
Storage Temperature Range
)
YELLOW GREEN
75
5
25
100
0.33
－35℃
to 85℃
－35℃
to 85℃
UNIT
mW
V
mA
mA
mA/℃
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25
℃
SYMBOL
V
F
IR
)
TYP.
2.2
568
570
30
0.72
1.8
MAX.
2.8
100
UNIT
V
μ
A
nm
nm
nm
mcd
PARAMETER
Forward Voltage , Per Segment
Reverse Current , Per Segment
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half－Width
Luminous Intensity Per Segment
TEST CONDITION MIN.
I
F
= 20mA
V
R
= 5V
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
I
F
= 10mA
λ
P
λ
D
Δ
λ
I
V
DRAWING NO. : DS-11-12-0204G
DATE : 2012-10-15
Page : 3
Release
by
PARALIGHTDCC
0.39
INCH SINGLE
C-391G B/W
DIGIT DISPLAY
REV:A / 0
DRAWING NO. : DS-11-12-0204G
DATE : 2012-10-15
Page : 4
Release
by
PARALIGHTDCC
0.39
—SOLDERING
METHOD
INCH SINGLE DIGIT DISPLAY
C-391G B/W
REV:A / 0
SOLDERING CONDITIONS
REMARK
—
Solder no closer than 2mm from
DIP
SOLDERING
Bath temperature: 260 max
Immersion time: within 5 sec
the base of the package
—
Using soldering flux,” RESIN FLUX”
is recommended.
—
During soldering, take care not to
Soldering iron: 30W or smaller
press the tip of iron against the
SOLDERING
Temperature at tip of iron: 260
℃
or lower PIN.
IRON
Soldering time: within 5 sec.
(To prevent heat from being
transferred directly to the PIN.)
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package
is fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and silver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
DRAWING NO. : DS-11-12-0204G
DATE : 2012-10-15
Page : 5
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