DATACOM, TIME SLOT ASSIGNER, PQFP208, SQFP-208
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | LSC/CSI |
| Parts packaging code | QFP |
| package instruction | FQFP, |
| Contacts | 208 |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQFP-G208 |
| JESD-609 code | e0 |
| length | 28 mm |
| Number of functions | 1 |
| Number of terminals | 208 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FQFP |
| Package shape | SQUARE |
| Package form | FLATPACK, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum seat height | 4.1 mm |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| Telecom integrated circuit types | TIME SLOT ASSIGNER |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 28 mm |
| T8100A--SC4-DB | T8102---SC4-DB | T8105---SC4-DB | T8102---BAL4-DB | T8105---BAL4-DB | T8100A--BAL4-DB | |
|---|---|---|---|---|---|---|
| Description | DATACOM, TIME SLOT ASSIGNER, PQFP208, SQFP-208 | DATACOM, TIME SLOT ASSIGNER, PQFP208, SQFP-208 | DATACOM, TIME SLOT ASSIGNER, PQFP208, SQFP-208 | DATACOM, TIME SLOT ASSIGNER, PBGA217, PLASTIC, BGA-217 | DATACOM, TIME SLOT ASSIGNER, PBGA217, PLASTIC, BGA-217 | DATACOM, TIME SLOT ASSIGNER, PBGA217, PLASTIC, BGA-217 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI |
| Parts packaging code | QFP | QFP | QFP | BGA | BGA | BGA |
| package instruction | FQFP, | FQFP, | FQFP, | PLASTIC, BGA-217 | PLASTIC, BGA-217 | PLASTIC, BGA-217 |
| Contacts | 208 | 208 | 208 | 217 | 217 | 217 |
| Reach Compliance Code | unknown | compliant | unknown | compliant | compliant | compliant |
| JESD-30 code | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B217 | S-PBGA-B217 | S-PBGA-B217 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 28 mm | 28 mm | 28 mm | 23 mm | 23 mm | 23 mm |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 208 | 208 | 208 | 217 | 217 | 217 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | FQFP | FQFP | FQFP | BGA | BGA | BGA |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | NOT SPECIFIED | 225 | 225 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.1 mm | 4.1 mm | 4.1 mm | 2.32 mm | 2.32 mm | 2.32 mm |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| Telecom integrated circuit types | TIME SLOT ASSIGNER | TIME SLOT ASSIGNER | TIME SLOT ASSIGNER | TIME SLOT ASSIGNER | TIME SLOT ASSIGNER | TIME SLOT ASSIGNER |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | NOT SPECIFIED | 30 | 30 |
| width | 28 mm | 28 mm | 28 mm | 23 mm | 23 mm | 23 mm |
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