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MK45H08N50

Description
8KX9 OTHER FIFO, 50ns, PDIP28, PLASTIC, DIP-28
Categorystorage    storage   
File Size386KB,16 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

MK45H08N50 Overview

8KX9 OTHER FIFO, 50ns, PDIP28, PLASTIC, DIP-28

MK45H08N50 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeDIP
package instructionPLASTIC, DIP-28
Contacts28
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time50 ns
Other featuresRETRANSMIT
period time65 ns
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length37.085 mm
memory density73728 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX9
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.002 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

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