SRAM Module, 128KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| package instruction | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 25 ns |
| Other features | ALSO CONFIGURABLE AS 512K X 8 |
| Spare memory width | 16 |
| I/O type | COMMON |
| JESD-30 code | S-CPGA-P66 |
| JESD-609 code | e0 |
| length | 27.3 mm |
| memory density | 4194304 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 66 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX32 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA66,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.6 mm |
| Maximum standby current | 0.032 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.5 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 27.3 mm |
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