Synchronous DRAM Module, 32MX72, 6ns, CMOS
Parameter Name | Attribute value |
Maker | SAMSUNG |
package instruction | , |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 6 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N168 |
memory density | 2415919104 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 168 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX72 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | DUAL |
KMM377S3320AT3-GL | KMM377S3320AT3-GH | |
---|---|---|
Description | Synchronous DRAM Module, 32MX72, 6ns, CMOS | Synchronous DRAM Module, 32MX72, 6ns, CMOS |
Maker | SAMSUNG | SAMSUNG |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 6 ns | 6 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N168 | R-XDMA-N168 |
memory density | 2415919104 bit | 2415919104 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 72 | 72 |
Number of functions | 1 | 1 |
Number of ports | 1 | 1 |
Number of terminals | 168 | 168 |
word count | 33554432 words | 33554432 words |
character code | 32000000 | 32000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 32MX72 | 32MX72 |
Package body material | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified |
self refresh | YES | YES |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL |