DATACOM, INTERFACE CIRCUIT, PDSO8, 0.150 INCH, SOIC-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Rochester Electronics |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 4.9 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | COMMERCIAL |
| Maximum seat height | 1.75 mm |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Telecom integrated circuit types | INTERFACE CIRCUIT |
| Temperature level | AUTOMOTIVE |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 20 |
| width | 3.9 mm |
| MAX3059ASA | MAX3058ASA | |
|---|---|---|
| Description | DATACOM, INTERFACE CIRCUIT, PDSO8, 0.150 INCH, SOIC-8 | DATACOM, INTERFACE CIRCUIT, PDSO8, 0.150 INCH, SOIC-8 |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Rochester Electronics | Rochester Electronics |
| Parts packaging code | SOIC | SOIC |
| package instruction | SOP, | SOP, |
| Contacts | 8 | 8 |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 |
| length | 4.9 mm | 4.9 mm |
| Humidity sensitivity level | 1 | 1 |
| Number of functions | 1 | 1 |
| Number of terminals | 8 | 8 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 | 240 |
| Certification status | COMMERCIAL | COMMERCIAL |
| Maximum seat height | 1.75 mm | 1.75 mm |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | YES |
| technology | BICMOS | BICMOS |
| Telecom integrated circuit types | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | 20 | 20 |
| width | 3.9 mm | 3.9 mm |
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