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N28F020-70

Description
Flash, 256KX8, 80ns, PQCC32, 0.450 X 0.550 INCH, PLASTIC, LCC-32
Categorystorage    storage   
File Size411KB,29 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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N28F020-70 Overview

Flash, 256KX8, 80ns, PQCC32, 0.450 X 0.550 INCH, PLASTIC, LCC-32

N28F020-70 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time80 ns
Other features100000 ERASE/PROGRAM CYCLES
command user interfaceYES
Data pollingNO
Durability100000 Write/Erase Cycles
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density2097152 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitNO
typeNOR TYPE
width11.43 mm

N28F020-70 Related Products

N28F020-70 F28F020-90 TF28F020-90 F28F020-70 E28F020-70 P28F020-70
Description Flash, 256KX8, 80ns, PQCC32, 0.450 X 0.550 INCH, PLASTIC, LCC-32 Flash, 256KX8, 90ns, PDSO32, 8 X 20 MM, REVERSE, TSOP-32 Flash, 256KX8, 90ns, PDSO32, 8 X 20 MM, REVERSE, TSOP-32 Flash, 256KX8, 80ns, PDSO32, 8 X 20 MM, REVERSE, TSOP-32 Flash, 256KX8, 80ns, PDSO32, 0.310 X 0.720 INCH, TSOP-32 Flash, 256KX8, 80ns, PDIP32, 0.620 X 1.640 INCH, PLASTIC, DIP-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ TSOP TSOP TSOP TSOP DIP
package instruction QCCJ, LDCC32,.5X.6 TSOP1-R, TSSOP32,.8,20 TSOP1-R, TSSOP32,.8,20 TSOP1-R, TSSOP32,.8,20 0.310 X 0.720 INCH, TSOP-32 DIP, DIP32,.6
Contacts 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 80 ns 90 ns 90 ns 80 ns 80 ns 80 ns
Other features 100000 ERASE/PROGRAM CYCLES 100000 ERASE/PROGRAM CYCLES 100000 ERASE/PROGRAM CYCLES 100000 ERASE/PROGRAM CYCLES 100000 ERASE/PROGRAM CYCLES 100000 ERASE/PROGRAM CYCLES
command user interface YES YES YES YES YES YES
Data polling NO NO NO NO NO NO
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PQCC-J32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32
JESD-609 code e0 e0 e0 e0 e0 e0
length 13.97 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 41.91 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ TSOP1-R TSOP1-R TSOP1-R TSOP1 DIP
Encapsulate equivalent code LDCC32,.5X.6 TSSOP32,.8,20 TSSOP32,.8,20 TSSOP32,.8,20 TSSOP32,.8,20 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 12 V 12 V 12 V 12 V 12 V 12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 4.83 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 2.54 mm
Terminal location QUAD DUAL DUAL DUAL DUAL DUAL
switch bit NO NO NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 11.43 mm 8 mm 8 mm 8 mm 8 mm 15.24 mm
Maker Intel Intel Intel - Intel Intel

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