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NPIS60P2R2MTRF

Description
1 ELEMENT, 1.5 uH, GENERAL PURPOSE INDUCTOR, SMD
CategoryPassive components   
File Size58KB,4 Pages
ManufacturerNIC
Websitehttps://www.niccomp.com
Download Datasheet View All

NPIS60P2R2MTRF Overview

1 ELEMENT, 1.5 uH, GENERAL PURPOSE INDUCTOR, SMD

NPIS Shielded Power Inductors
FEATURES
• SHIELDED POWER INDUCTOR
• HIGH CURRENT (UP TO 75 AMPS)
• SURFACE MOUNTABLE CONSTRUCTION
• LOW PROFILE (3.0, 3.5, 4.0 & 5mm MAXIMUM HEIGHT)
• TAPED AND REELED FOR AUTOMATIC INSERTION
• FOR USE IN DC/DC CONVERTERS
CHARACTERISTICS
Case Size
Inductance Range
Ambient Operating Temperature Range
Maximum Component Temperature
(Ambient + Self-Heating)
Temperatrue Rise at Irms
Inductance Change at Isat
Inductance Tolerance
Resistance to Solder Heat
NPIS_P
0.1 ~ 10μH
-55°C ~ +125°C
+155°C
+40°C max.
-20% typical
20% (M)
260°C for 5 seconds
B
7.0 max.
7.0 max.
10.5 max.
13.5 max.
13.5 max.
13.9 max.
C
2.4 max.
3.2 max.
4.2 max.
3.8 max.
5.2 max.
5.4 max.
D
1.6 ± 0.5
1.6 ± 0.5
2.2 ± 0.5
2.5 ± 0.5
2.5 ± 0.5
7.6 ± 0.3
E
2.1 ± 0.5
2.1 ± 0.5
2.9 ± 0.5
3.0 ± 0.5
3.0 ± 0.5
2.0 ± 0.3
F
2.5
2.5
3.5
3.35
3.35
2.2 ± 0.3
G
3.7
3.7
5.4
7.1
7.1
-
H
3.5
3.5
4.5
4.5
4.5
-
NPIS__P Series
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
DIMENSIONS (mm)
Series
NPIS60P
NPIS63P
NPIS14P
NPIS23P
NPIS25P
NPIS24P
A
7.8 max.
7.8 max.
11.8 max.
13.9 max.
13.9 max.
13.9 max.
NPIS60P, 63P, 14P, 23P & 25P
A
D
NPIS24P
C
B
B
R56
E
R68
A
F
LAND PATTERN
C
F
2.5mm
REFLOW SOLDERING PROFILE
300
Temperature °C
250
200
150
100
50
25
®
30
60
90 120 150 180 210 240 270 300
Time - Seconds
Pre-Heat
150°C ~ 180°C
60 ~ 120 sec.
Time above 230°C
30 seconds max.
Soldering 260°C max.
5 seconds max.
2.4mm
9.7mm
15mm
E
D
H
G
2.9mm
5.0mm
Cool Down
124
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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