Non-Volatile SRAM, 256KX16, 45ns, CMOS, PBGA48, 6 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Cypress Semiconductor |
Parts packaging code | BGA |
package instruction | TFBGA, BGA48,6X8,30 |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 45 ns |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 10 mm |
memory density | 4194304 bit |
Memory IC Type | NON-VOLATILE SRAM |
memory width | 16 |
Mixed memory types | N/A |
Number of functions | 1 |
Number of terminals | 48 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA48,6X8,30 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.003 A |
Maximum slew rate | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 6 mm |