Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO6
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Nexperia |
package instruction | XSON-6 |
Reach Compliance Code | compliant |
series | AUP/ULP/V |
JESD-30 code | R-PDSO-N6 |
JESD-609 code | e3 |
length | 1.45 mm |
Logic integrated circuit type | INVERTER |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of entries | 1 |
Number of terminals | 6 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VSON |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
propagation delay (tpd) | 20 ns |
Certification status | Not Qualified |
Maximum seat height | 0.5 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 0.8 V |
Nominal supply voltage (Vsup) | 1.1 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Tin (Sn) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 1 mm |
74AUP1G14GM | 74AUP1G14GX | 74AUP1G14GS | 74AUP1G14GV | 74AUP1G14GN | 74AUP1G14GW | 74AUP1G14GF | |
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Description | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO6 | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO5 | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO6 | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO5 | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO6 | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO5 | Inverter, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, PDSO6 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
package instruction | XSON-6 | X2SON-5 | XSON-6 | SOT-753, 5 PIN | XSON-6 | TSSOP, | VSON, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
series | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
JESD-30 code | R-PDSO-N6 | S-PBCC-B5 | S-PDSO-N6 | R-PDSO-G5 | R-PDSO-N6 | R-PDSO-G5 | S-PDSO-N6 |
JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
length | 1.45 mm | 0.8 mm | 1 mm | 2.9 mm | 1 mm | 2.05 mm | 1 mm |
Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of entries | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 6 | 5 | 6 | 5 | 6 | 5 | 6 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VSON | HVBCC | VSON | TSOP | SON | TSSOP | VSON |
Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
propagation delay (tpd) | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
Maximum seat height | 0.5 mm | 0.35 mm | 0.35 mm | 1.1 mm | 0.35 mm | 1.1 mm | 0.5 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
Nominal supply voltage (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
Terminal form | NO LEAD | BUTT | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD |
Terminal pitch | 0.5 mm | 0.48 mm | 0.35 mm | 0.95 mm | 0.3 mm | 0.65 mm | 0.35 mm |
Terminal location | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
width | 1 mm | 0.8 mm | 1 mm | 1.5 mm | 0.9 mm | 1.25 mm | 1 mm |
Certification status | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |