EEPROM, 2KX8, Serial, CMOS, TDFN-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Catalyst |
Parts packaging code | DFN |
package instruction | SON, SOLCC8,.12,25 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 0.1 MHz |
Data retention time - minimum | 100 |
Durability | 1000000 Write/Erase Cycles |
I2C control byte | 1010DDDR |
JESD-30 code | S-XDSO-N8 |
JESD-609 code | e0 |
memory density | 16384 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 2048 words |
character code | 2000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2KX8 |
Package body material | UNSPECIFIED |
encapsulated code | SON |
Encapsulate equivalent code | SOLCC8,.12,25 |
Package shape | SQUARE |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3/5 V |
Certification status | Not Qualified |
Serial bus type | I2C |
Maximum standby current | 0.000001 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 0.635 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Maximum write cycle time (tWC) | 5 ms |
write protect | HARDWARE |