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TC7W32FU(TE12L,F)

Description
IC GATE OR DUAL 2INPUT 8-SSOP
Categorylogic    logic   
File Size208KB,8 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Environmental Compliance
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TC7W32FU(TE12L,F) Overview

IC GATE OR DUAL 2INPUT 8-SSOP

TC7W32FU(TE12L,F) Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerToshiba Semiconductor
package instruction0.65 MM PITCH, PLASTIC, SSOP-8
Reach Compliance Codeunknown
seriesHC/UH
JESD-30 codeR-PDSO-G8
length2.9 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeOR GATE
MaximumI(ol)0.004 A
Number of functions2
Number of entries2
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeTSSOP8,.16
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
power supply2/6 V
Prop。Delay @ Nom-Sup95 ns
propagation delay (tpd)95 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.3 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width2.8 mm

TC7W32FU(TE12L,F) Related Products

TC7W32FU(TE12L,F) TC7W32FU(TE12L)
Description IC GATE OR DUAL 2INPUT 8-SSOP IC HC/UH SERIES, DUAL 2-INPUT OR GATE, PDSO8, 0.65 MM PITCH, PLASTIC, SSOP-8, Gate
Is it Rohs certified? conform to incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor
package instruction 0.65 MM PITCH, PLASTIC, SSOP-8 LSSOP,
Reach Compliance Code unknown unknow
series HC/UH HC/UH
JESD-30 code R-PDSO-G8 R-PDSO-G8
length 2.9 mm 2.9 mm
Load capacitance (CL) 50 pF 50 pF
Logic integrated circuit type OR GATE OR GATE
Number of functions 2 2
Number of entries 2 2
Number of terminals 8 8
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP LSSOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
propagation delay (tpd) 95 ns 19 ns
Certification status Not Qualified Not Qualified
Maximum seat height 1.3 mm 1.3 mm
Maximum supply voltage (Vsup) 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm
Terminal location DUAL DUAL
width 2.8 mm 2.8 mm
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