MV6100A datasheet, PDF - EEWORLD Datasheet

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MV6100A: DescriptionRectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14; CategoryDiscrete semiconductor diode; File Size61KB，2 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MV6100A Overview

Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14

MV6100A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	R-CDFP-F14
Contacts	14
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	HIGH RELIABILITY
Configuration	SEPARATE, 7 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
JESD-30 code	R-CDFP-F14
JESD-609 code	e0
Number of components	7
Number of terminals	14
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Maximum output current	0.3 A
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum power dissipation	0.4 W
Certification status	Not Qualified
Maximum reverse recovery time	0.01 µs
surface mount	YES
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

MV6100A Preview

6100A

Isolated Diode Array with

HiRel MQ, MX, MV, and SP Screening Options

SCOTTSDALE DIVISION

DESCRIPTION

These low capacitance diode arrays are multiple, discrete, isolated junctions

fabricated by a planar process and mounted in a 14-PIN package for use as steering

diodes protecting up to seven I/O ports from ESD, EFT, or surge by directing them

either to the positive side of the power supply line or to ground (see figure 1). An

external TVS diode may be added between the positive supply line and ground to

prevent overvoltage on the supply rail. They may also be used in fast switching core-

driver applications. This includes computers and peripheral equipment such as

magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding

or encoding applications. These arrays offer many advantages of integrated circuits

such as high-density packaging and improved reliability. This is a result of fewer

pick and place operations, smaller footprint, smaller weight, and elimination of

various discrete packages that may not be as user friendly in PC board mounting.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

APPEARANCE

WWW .

Microsemi

14-PIN Ceramic

Flat Pack

FEATURES

•

Hermetic Ceramic Package

Isolated Diodes to Eliminate Cross-Talk Voltages

High Breakdown Voltage V

> 75 V at 5

μA

Low Leakage I

< 100 nA at 40 V

Low Capacitance C < 4.0 pF

Switching Speeds less than 10 ns

Options for screening in accordance with MIL-PRF-

19500/474 for JAN, JANTX, JANTXV, and JANS are

available by adding MQ, MX, MV, or SP prefixes

respectively to part numbers. For example, designate

MX6100A for a JANTX screen.

•

APPLICATIONS / BENEFITS

High Frequency Data Lines

RS-232 & RS-422 Interface Networks

Ethernet: 10 Base T

Computer I/O Ports

LAN

Switching Core Drivers

IEC 61000-4 Compatible (See Circuit in

Figure 1)

61000-4-2 (ESD): Air 15 kV, contact – 8 kV

61000-4-4 (EFT): 40 A – 5/50 ns

61000-4-5 (surge): 12 A, 8/20 µs

MAXIMUM RATINGS

•

Reverse Breakdown Voltage of 75 Vdc (Note 1 & 2)

Continuous Forward Current of 300 mA dc (Note 1 & 3)

Peak Surge Current (tp=1/120 s) of 500 mA dc (Note 1)

400 mW Power Dissipation per Junction @ 25 C

500 mW Power Dissipation per Package @ 25

C (Note 4)

Operating Junction Temperature range –65 to +150

Storage Temperature range of –65 to +150

NOTE 1:

NOTE 2:

NOTE 3:

NOTE 4:

Each Diode

Pulsed: P

= 100 ms max; duty cycle <20%

Derate at 2.4 mA/ C above +25 C

Derate at 4.0 mW/ C above +25 C

MECHANICAL AND PACKAGING

•

14-PIN Ceramic Flat Pack

Weight 0.29 grams (approximate)

Marking: Logo, part number, date code and

dot identifying pin #1

Carrier Tubes; 19 pcs (standard)

ELECTRICAL CHARACTERISTICS (Per Diode) @ 25

C unless otherwise specified

MAXIMUM

FORWARD

VOLTAGE

= 100 mA

(Note 1)

MAXIMUM

REVERSE

CURRENT

= 40 V

µA

MAXIMUM

REVERSE

CURRENT

= 20 V

MAXIMUM

CAPACITANCE

(PIN TO PIN)

MAXIMUM

FORWARD

RECOVERY

TIME

= 100 mA

MAXIMUM

REVERSE

RECOVERY TIME

trr

= 10 mAdc

= 1 mAdc

= 100 ohms

6100A

= 0 V

F = 1 MHz

PART

NUMBER

MAXIMUM

FORWARD

VOLTAGE

MATCH

= 10 mA

6100A

0.1

4.0

NOTE 1:

Pulsed: P

= 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.

2007

3-27-2007

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

6100A

Isolated Diode Array with

HiRel MQ, MX, MV, and SP Screening Options

SCOTTSDALE DIVISION

SYMBOLS & DEFINITIONS

Symbol

DEFINITION

Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.

Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.

Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and

temperature.

Capacitance: The capacitance of the TVS as defined @ 0 volts at a frequency of 1 MHz and stated in

picofarads.

WWW .

Microsemi

SCHEMATIC

PACKAGE DIMENSIONS

CIRCUIT

Supply rail (+V

)

I/O Port

Symbol

LO2

GND (or -V

)

Steering Diode Application

FIGURE 1

Inches

Min

Max

.390

.235

.260

.045

.095

.250

.370

.005

.026

.045

.050 BSC

.003

.006

.280

.010

.019

Millimeters

Min

Max

9.91

5.97

6.60

1.14

2.41

6.35

9.40

0.13

0.66

1.14

1.27 BSC

0.08

0.15

7.11

0.25

0.48

6100A

2007

3-27-2007

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 2

More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

MV6100A Related Products

	MV6100A	MQ6100A	MX6100A	SP6100A
Description	Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14	Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14	Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14	Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Microsemi	Microsemi	Microsemi	Microsemi
package instruction	R-CDFP-F14	R-CDFP-F14	R-CDFP-F14	R-CDFP-F14
Contacts	14	14	14	14
Reach Compliance Code	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
Other features	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY
Configuration	SEPARATE, 7 ELEMENTS	SEPARATE, 7 ELEMENTS	SEPARATE, 7 ELEMENTS	SEPARATE, 7 ELEMENTS
Diode component materials	SILICON	SILICON	SILICON	SILICON
Diode type	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE
JESD-30 code	R-CDFP-F14	R-CDFP-F14	R-CDFP-F14	R-CDFP-F14
JESD-609 code	e0	e0	e0	e0
Number of components	7	7	7	7
Number of terminals	14	14	14	14
Maximum operating temperature	150 °C	150 °C	150 °C	150 °C
Minimum operating temperature	-65 °C	-65 °C	-65 °C	-65 °C
Maximum output current	0.3 A	0.3 A	0.3 A	0.3 A
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum power dissipation	0.4 W	0.4 W	0.4 W	0.4 W
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum reverse recovery time	0.01 µs	0.01 µs	0.01 µs	0.01 µs
surface mount	YES	YES	YES	YES
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	FLAT	FLAT	FLAT	FLAT
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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