DM75S07AJ/883 datasheet, PDF - EEWORLD Datasheet

DM75S07AJ/883: DescriptionIC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC; Categorystorage storage; File Size438KB，8 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM75S07AJ/883 Overview

IC,SRAM,16X4,S-TTL,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP16,.3
Reach Compliance Code	compliant
Maximum access time	30 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	4
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.1 mA
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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