MSP430F6633IZQW datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> MSP430F6633IZQW

MSP430F6633IZQW: Description16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，132 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

Stay tuned Parametric Compare

MSP430F6633IZQW Overview

16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113

MSP430F6633IZQW Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	PLASTIC, BGA-113
Contacts	113
Reach Compliance Code	unknown
Has ADC	YES
Other features	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
Address bus width
bit size	16
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B113
length	7 mm
Number of I/O lines	74
Number of terminals	113
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1 mm
speed	20 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.4 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

MSP430F6633IZQW Related Products

	MSP430F6633IZQW	MSP430F6631IZQW	MSP430F6631IZQWT	MSP430F6630IZQW	MSP430F6630IZQWT	MSP430F6632IZQW	MSP430F6632IZQWT	MSP430F6634IZQW
Description	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	PLASTIC, BGA-113	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,
Contacts	113	113	113	113	113	113	113	113
Reach Compliance Code	unknown	unknown	compliant	unknown	compliant	unknown	compliant	unknown
Has ADC	YES	NO	NO	NO	NO	NO	NO	YES
Other features	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES 1.8V AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
bit size	16	16	16	16	16	16	16	16
maximum clock frequency	20 MHz	20 MHz	32 MHz	20 MHz	32 MHz	20 MHz	32 MHz	20 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113
length	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
Number of I/O lines	74	74	74	74	74	74	74	74
Number of terminals	113	113	113	113	113	113	113	113
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
speed	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	-	Not Qualified

Recommended Resources

One of the reverse braking circuits for forward and reverse operation

Capacitance measuring instrument circuit

Touch voltage regulator circuit

Precision limiting triangle wave generator circuit diagram

Computer motherboard circuit diagram 810 2_35

A high-precision thermostatic controller circuit without temperature step zone

What is the function of this solder joint on the PCB?: In the following two pictures, what is the function of P$1? Why is P$1 written there? It seems to be connected to the USB shell. What is its function?...; sky999 PCB Design

Power battery pack characteristic analysis and balanced management: Electric vehicles, which are considered to be the cars of the future, are a combination of three major technologies: electric power source, motor and vehicle. Electric power source is the core compone...; zbz0529 Power technology

Can I change my nickname in the forum?: Can I change my nickname on the forum? I feel like the nickname I set before is ridiculous....; 小打小闹赢大奖 Talking

GD32L233C-START Review——03_2.CoreMark Test, RT-Thread-Nano Porting: *(Continued from the previous article...)* This article is about porting RT-Thread-Nano. # 7. Introduction to RT-ThreadRT-Thread, the full name is Real Time-Thread. As the name implies, it is an embed...; wadeRen GD32 MCU

Freescale Introduces QUICC Engine Technology for the Connected Digital Home: Freescale Semiconductor has introduced the first PowerQUICC? processor family 　with QUICC Engine? technology designed specifically for the consumer and SOHO networking device markets . The MPC8323E Po...; lorant Mobile and portable

A detailed guide to the Industrial Internet of Things: From risks to benefits: As the Industrial Internet of Things (IIoT) is increasingly being used, here’s everything you need to know about it, including the benefits, business, and associated risks. 　　The emergence of new tech...; Jacktang Wireless Connectivity

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components