M2066-12-669.3120 datasheet, PDF

M2066-12-669.3120: DescriptionSupport Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36; CategoryWireless rf/communication Telecom circuit; File Size477KB，12 Pages; ManufacturerIDT (Integrated Device Technology)

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M2066-12-669.3120 Overview

Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	LCC
package instruction	QCCN,
Contacts	36
Reach Compliance Code	unknown
app	SONET;SDH
JESD-30 code	S-CQCC-N36
JESD-609 code	e0
length	8.99 mm
Number of functions	1
Number of terminals	36
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	3.1 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	0.635 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	8.99 mm

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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