Flash Card, 8MX16, 150ns, CARD
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microsemi |
Parts packaging code | DIE |
package instruction | DIE, |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 150 ns |
Other features | 5 V OPERATION IS ALSO POSSIBLE |
JESD-30 code | R-XUUC-N |
memory density | 134217728 bit |
Memory IC Type | FLASH CARD |
memory width | 16 |
Number of functions | 1 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8MX16 |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 3.3 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | SLC NAND TYPE |