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IDT71T6480HS166BF

Description
QDR SRAM, 512KX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Categorystorage    storage   
File Size169KB,17 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT71T6480HS166BF Overview

QDR SRAM, 512KX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

IDT71T6480HS166BF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionTBGA,
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time2.5 ns
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density9437184 bit
Memory IC TypeQDR SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width13 mm
9Mb Pipelined
QDR™ SRAM
Burst of 4
x
x
Advance
Information
IDT71T6480H
Features
9Mb Density (512K x 18)
Separate Independent Read and Write Data Ports
— Supports concurrent transactions
333 MHz Data Rate for High Bandwidth Applications
Fast Clock-to Valid access times
— 2.5ns for 166 MHz version
4-Word Burst for reduced address bus frequency
(same as the external clock rate)
Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 333 MHz)
Two input clocks (K and
K),
using rising edges only, for
precise DDR timing
Two output clocks (C and
C)
compensate for clock skew
and flight time mismatches
— Clock and data delivered together to receiving device
Single multiplexed address input bus latches address
inputs for both READ and WRITE ports
Separate Port Enables for depth expansion
Synchronous internally self-timed writes
2.5V core power supply with HSTL Inputs and Outputs
165-ball, 1.0mm pitch 13mm x 15mm fBGA package
Variable drive HSTL output buffers
JTAG Interface
Description
The IDT71T6480H is a 2.5V synchronous pipelined SRAM equipped
with QDR™ architecture. QDR architecture consists of two separate
ports to access the memory array. The Read port has dedicated Data
Outputs to support Read operations, and the Write Port has dedi-
cated Data Inputs to support Write operations. QDR architecture has
separate data inputs and data outputs to completely eliminate the
need to “turn-around” the data bus required with common I/O de-
vices. Access to each port is accomplished through a common ad-
dress bus. Addresses for Read and Write addresses are latched on
alternate rising edges of the input (K) clock. Accesses to the IDT71T6480H
Read and Write ports are completely independent of one another. In
order to maximize data throughout, both Read and Write ports are equipped
with Double Data Rate (DDR) interfaces. Each address location is asso-
ciated with four 18-bit words that burst sequentially into or out of the
device. Since data can be transferred into and out of the device on every
rising edge of both input clocks (K/K and C/C), memory bandwidth is
maximized while simplifying system design by eliminating bus “turn-
arounds.”
Depth expansion is accomplished with Port Enables for each port.
Port enables allow each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or
K
input clocks. All data outputs pass through output registers
controlled by the C or
C
input clocks. Writes are conducted with on-
chip synchronous self-timed write circuitry.
x
x
x
x
x
x
x
x
x
x
x
x
x
Pin Description Summary
A
0
- A
17
RPE
WPE
BW
0
,
BW
1
K,
K
C,
C
D
0
-
D
17
Q
0
-
Q
17
ZQ
TMS, TDI, TCK
TDO
V
REF
V
DD,
V
DDQ
V
SS
Address Inputs
Read Port Enable
Write Port Enable
Individual Byte Write Selects
Clock signals for Data, Address and Control Inputs
Data Output Clocks
Data Input
Data Output
Output Impedance Matching Input
JTAG Inputs
JTAG Output
Reference Voltage Input
Core and Output Power
Ground
Input
Input
Input
Input
Input
Input
Input
Output
Input
Input
Input
Input
Supply
Supply
Synchronous
Synchronous
Synchronous
Synchronous
N/A
N/A
Synchronous
Synchronous
Static
N/A
N/A
Static
Static
Static
5285 tbl 01
QDR SRAMs and Quad Data Rate comprise a new family of products developed by IDT Inc., Cypress Semiconductor and Micron Technology.
FEBRUARY 2000
DSC-5284/04
1
©2000 Integrated Device Technology, Inc.

IDT71T6480HS166BF Related Products

IDT71T6480HS166BF IDT71T6480HS100BF IDT71T6480HS133BF
Description QDR SRAM, 512KX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 QDR SRAM, 512KX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 QDR SRAM, 512KX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA
package instruction TBGA, TBGA, TBGA,
Contacts 165 165 165
Reach Compliance Code compliant compliant compli
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 2.5 ns 3 ns 3 ns
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609 code e0 e0 e0
length 15 mm 15 mm 15 mm
memory density 9437184 bit 9437184 bit 9437184 bi
Memory IC Type QDR SRAM QDR SRAM QDR SRAM
memory width 18 18 18
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of terminals 165 165 165
word count 524288 words 524288 words 524288 words
character code 512000 512000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 512KX18 512KX18 512KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA TBGA TBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 2.6 V 2.6 V 2.6 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20
width 13 mm 13 mm 13 mm

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