MMBZ5221B - MMBZ5259B
300 MW Surface Mount Zener Diodes
Features
Planar Die Construction
300 mW Power Dissipation on FR-4 PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly Process
SOT-23
Dim
A
Min
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013
0.903
0.45
0.085
0°
Max
0.51
1.40
2.50
1.03
0.60
2.05
3.00
0.10
1.10
0.61
0.180
8°
A
B
B
C
C
D
E
G
H
M
L
Mechanical Data
E
D
G
H
K
J
Case: SOT-23, Molded Plastic
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: See Diagrams
Weight: 0.008 grams (approx.)
Marking : Marking Code (See Table On Page 2)
J
K
L
M
a
All Dimensions in mm
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
PARAMETER
Maximum Forward Voltage Diode at I
F
= 100 mA
Maximum Power Dissipation
(Notes 1)
at 25°C
Peak Forward Surge Current, 8.3 ms single half sine-wave
superimposed on rated load
(JEDEC method) (Notes 2)
Operating Junction and Storage Temperature Range
2
SYMBOL
V
F
P
D
I
FSM
T
J
VALUE
1.0
300
4.0
-55~150
UNITS
V
mW
Amps
℃
1. Mounted on 5.0 mm (.013mm thick) land areas. 2. Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.
2. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum.
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