|
ISL89401AR3Z-T |
ISL89401AR3Z |
ISL89401ABZ-T |
ISL89401ABZ-TK |
ISL89400AR3Z-T |
Description |
100V, 1.25A Peak, High Frequency Half-Bridge Drivers; DFN9, SOIC8; Temp Range: -40° to 125°C |
100V, 1.25A Peak, High Frequency Half-Bridge Drivers; DFN9, SOIC8; Temp Range: -40° to 125°C |
100V, 1.25A Peak, High Frequency Half-Bridge Drivers; DFN9, SOIC8; Temp Range: -40° to 125°C |
100V, 1.25A Peak, High Frequency Half-Bridge Drivers; DFN9, SOIC8; Temp Range: -40° to 125°C |
100V, 1.25A Peak, High Frequency Half-Bridge Drivers; DFN9, SOIC8; Temp Range: -40° to 125°C |
Brand Name |
Intersil |
Intersil |
Intersil |
Intersil |
Intersil |
Maker |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Parts packaging code |
DFN, SOIC |
DFN, SOIC |
DFN, SOIC |
DFN, SOIC |
DFN, SOIC |
package instruction |
HVSON, SOLCC9/10,.12,20 |
HVSON, SOLCC9/10,.12,20 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
HVSON, SOLCC9/10,.12,20 |
Contacts |
9, 8 |
9, 8 |
9, 8 |
9, 8 |
9, 8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
high side driver |
YES |
YES |
YES |
YES |
YES |
Interface integrated circuit type |
HALF BRIDGE BASED MOSFET DRIVER |
HALF BRIDGE BASED MOSFET DRIVER |
HALF BRIDGE BASED MOSFET DRIVER |
HALF BRIDGE BASED MOSFET DRIVER |
HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 code |
S-PDSO-N9 |
S-PDSO-N9 |
R-PDSO-G8 |
R-PDSO-G8 |
S-PDSO-N9 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
length |
3 mm |
3 mm |
4.9 mm |
4.9 mm |
3 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
9 |
9 |
8 |
8 |
9 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Nominal output peak current |
1.25 A |
1.25 A |
1.25 A |
1.25 A |
1.25 A |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVSON |
HVSON |
SOP |
SOP |
HVSON |
Encapsulate equivalent code |
SOLCC9/10,.12,20 |
SOLCC9/10,.12,20 |
SOP8,.25 |
SOP8,.25 |
SOLCC9/10,.12,20 |
Package shape |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
12 V |
12 V |
12 V |
12 V |
12 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1 mm |
1 mm |
1.75 mm |
1.75 mm |
1 mm |
Maximum supply voltage |
14 V |
14 V |
14 V |
14 V |
14 V |
Minimum supply voltage |
9 V |
9 V |
9 V |
9 V |
9 V |
Nominal supply voltage |
12 V |
12 V |
12 V |
12 V |
12 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Terminal form |
NO LEAD |
NO LEAD |
GULL WING |
GULL WING |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
1.27 mm |
1.27 mm |
0.5 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
30 |
30 |
NOT SPECIFIED |
30 |
Disconnect time |
60 µs |
60 µs |
60 µs |
60 µs |
60 µs |
connection time |
60 µs |
60 µs |
60 µs |
60 µs |
60 µs |
width |
3 mm |
3 mm |
3.9 mm |
3.9 mm |
3 mm |
Factory Lead Time |
23 weeks |
6 weeks |
7 weeks |
- |
6 weeks |