Digital Signal Processor, CMOS, CPGA269
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Array Microsystems Inc. |
package instruction | PGA, PGA269,15X21MOD |
Reach Compliance Code | unknown |
JESD-30 code | R-XPGA-P269 |
JESD-609 code | e0 |
Number of terminals | 269 |
Package body material | CERAMIC |
encapsulated code | PGA |
Encapsulate equivalent code | PGA269,15X21MOD |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Maximum slew rate | 650 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
A66110AMG/H | A66110BMG/H | |
---|---|---|
Description | Digital Signal Processor, CMOS, CPGA269 | Digital Signal Processor, CMOS, CPGA269 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Array Microsystems Inc. | Array Microsystems Inc. |
package instruction | PGA, PGA269,15X21MOD | PGA, PGA269,15X21MOD |
Reach Compliance Code | unknown | unknown |
JESD-30 code | R-XPGA-P269 | R-XPGA-P269 |
JESD-609 code | e0 | e0 |
Number of terminals | 269 | 269 |
Package body material | CERAMIC | CERAMIC |
encapsulated code | PGA | PGA |
Encapsulate equivalent code | PGA269,15X21MOD | PGA269,15X21MOD |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
Nominal supply voltage | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG | PIN/PEG |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | PERPENDICULAR | PERPENDICULAR |