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AM27C2048-255DCB

Description
UVPROM, 128KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40
Categorystorage    storage   
File Size98KB,12 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM27C2048-255DCB Overview

UVPROM, 128KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40

AM27C2048-255DCB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeDIP
package instructionDIP, DIP40,.6
Contacts40
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time250 ns
I/O typeCOMMON
JESD-30 codeR-CDIP-T40
JESD-609 codee0
memory density2097152 bit
Memory IC TypeUVPROM
memory width16
Number of functions1
Number of terminals40
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX16
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0001 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
FINAL
Am27C2048
2 Megabit (128 K x 16-Bit) CMOS EPROM
DISTINCTIVE CHARACTERISTICS
s
Fast access time
— Speed options as fast as 55 ns
s
Low power consumption
— 100 µA maximum CMOS standby current
s
JEDEC-approved pinout
— Plug-in upgrade of 1 Mbit EPROM
— 40-pin DIP/PDIP
— 44-pin PLCC
s
Single +5 V power supply
s
±10%
power supply tolerance standard
s
100% Flashrite programming
— Typical programming time of 16 seconds
s
Latch-up protected to 100 mA from –1 V to
V
CC
+ 1 V
s
Versatile features for simple interfacing
— Both CMOS and TTL input/output compatibility
— Two line control functions
s
High noise immunity
GENERAL DESCRIPTION
The Am27C2048 is a 2 Mbit, ultraviolet erasable pro-
grammable read-only memory. It is organized as 128 K
words, operates from a single +5 V supply, has a static
standby mode, and features fast single address loca-
tion programming. The Am27C2048 is ideal for use in
16-bit microprocessor systems. The device is available
in windowed ceramic DIP packages, and plastic one
time programmable (OTP) PDIP and PLCC packages.
Data can be typically accessed in less than 55 ns, al-
lowing high-performance microprocessors to operate
without any WAIT states. The device offers separate
Output Enable (OE#) and Chip Enable (CE#) controls,
thus eliminating bus contention in a multiple bus micro-
processor system.
AMD’s CMOS process technology provides high
speed, low power, and high noise immunity. Typical
power consumption is only 125 mW in active mode,
and 100 µW in standby mode.
All signals are TTL levels, including programming sig-
nals. Bit locations may be programmed singly, in
blocks, or at random. The device supports AMD’s
Flashrite programming algorithm (100 µs pulses), re-
sulting in a typical programming time of 16 seconds.
BLOCK DIAGRAM
V
CC
V
SS
V
PP
OE#
CE#
PGM#
Output Enable
Chip Enable
and
Prog Logic
Y
Decoder
A0–A16
Address
Inputs
Output
Buffers
Data Outputs
DQ0–DQ15
Y
Gating
X
Decoder
2,097,152
Bit Cell
Matrix
11407G-1
Publication#
11407
Rev:
G
Amendment/0
Issue Date:
May 1998

AM27C2048-255DCB Related Products

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Description UVPROM, 128KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 UVPROM, 128KX16, 55ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 UVPROM, 128KX16, 55ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 UVPROM, 128KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 UVPROM, 128KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 OTP ROM, 128KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44 OTP ROM, 128KX16, 250ns, CMOS, PQCC44, PLASTIC, LCC-44 OTP ROM, 128KX16, 120ns, CMOS, PDIP40, PLASTIC, DIP-40 OTP ROM, 128KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD AMD AMD AMD AMD AMD
Parts packaging code DIP DIP DIP DIP DIP LCC LCC DIP LCC
package instruction DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ DIP, DIP40,.6 QCCJ, LDCC44,.7SQ
Contacts 40 40 40 40 40 44 44 40 44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 250 ns 55 ns 55 ns 150 ns 120 ns 150 ns 250 ns 120 ns 150 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 S-PQCC-J44 S-PQCC-J44 R-PDIP-T40 S-PQCC-J44
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 16 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 40 40 40 40 40 44 44 40 44
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C
organize 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP QCCJ QCCJ DIP QCCJ
Encapsulate equivalent code DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 LDCC44,.7SQ LDCC44,.7SQ DIP40,.6 LDCC44,.7SQ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.25 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.25 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.75 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.75 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND J BEND THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL QUAD QUAD DUAL QUAD

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