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SST55LD019M-45-I-TQWE

Description
Flash Memory Drive, IDE Compatible, CMOS, PQFP100, 16 X 16 MM, ROHS COMPLIANT, MS-026AED, TQFP-100
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size902KB,59 Pages
ManufacturerSilicon Laboratories Inc
Environmental Compliance
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SST55LD019M-45-I-TQWE Overview

Flash Memory Drive, IDE Compatible, CMOS, PQFP100, 16 X 16 MM, ROHS COMPLIANT, MS-026AED, TQFP-100

SST55LD019M-45-I-TQWE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSilicon Laboratories Inc
Parts packaging codeQFP
package instructionTFQFP,
Contacts100
Reach Compliance Codeunknown
Other featuresALSO REQUIRES 5 V SUPPLY
Drive interface standardsIDE
External data bus width16
Maximum host data transfer rate10 MBps
Host interface standardATA
JESD-30 codeS-PQFP-G100
JESD-609 codee3
length14 mm
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTFQFP
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width14 mm
uPs/uCs/peripheral integrated circuit typeSECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

SST55LD019M-45-I-TQWE Related Products

SST55LD019M-45-I-TQWE SST55LD019M-45-I-BWE SST55LD019M-45-I-MVWE
Description Flash Memory Drive, IDE Compatible, CMOS, PQFP100, 16 X 16 MM, ROHS COMPLIANT, MS-026AED, TQFP-100 Flash Memory Drive, IDE Compatible, CMOS, PBGA84, 9 X 9 MM, ROHS COMPLIANT, MO-210, TFBGA-84 Flash Memory Drive, IDE Compatible, CMOS, PBGA85, 6 X 6 MM, COMPLIANT, MO-225, VFBGA-85
Maker Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc
Parts packaging code QFP BGA BGA
package instruction TFQFP, TFBGA, VFBGA,
Contacts 100 84 85
Reach Compliance Code unknown unknown unknown
Other features ALSO REQUIRES 5 V SUPPLY ALSO REQUIRES 5 V SUPPLY ALSO REQUIRES 5 V SUPPLY
Drive interface standards IDE IDE IDE
External data bus width 16 16 16
Maximum host data transfer rate 10 MBps 10 MBps 10 MBps
Host interface standard ATA ATA ATA
JESD-30 code S-PQFP-G100 S-PBGA-B84 S-PBGA-B85
length 14 mm 9 mm 6 mm
Number of terminals 100 84 85
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFQFP TFBGA VFBGA
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 0.96 mm
Maximum supply voltage 3.465 V 3.465 V 3.465 V
Minimum supply voltage 3.135 V 3.135 V 3.135 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING BALL BALL
Terminal pitch 0.5 mm 0.8 mm 0.5 mm
Terminal location QUAD BOTTOM BOTTOM
width 14 mm 9 mm 6 mm
uPs/uCs/peripheral integrated circuit type SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
JESD-609 code e3 - e1
Terminal surface Matte Tin (Sn) - TIN SILVER COPPER
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