Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
XMC1301-T038F0032 AB
MA001408470
PG-TSSOP-38-9
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
palladium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-05-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.226
0.015
0.060
1.199
48.679
0.003
0.311
0.192
7.479
56.249
2.200
0.337
0.111
0.332
Average
Mass
[%]
1.04
0.01
0.05
1.01
41.12
0.00
0.26
0.16
6.32
47.52
1.86
0.28
0.09
0.28
14. September 2015
118.39 mg
Sum
[%]
1.04
Average
Mass
[ppm]
10353
127
506
10126
42.19
411170
27
0.26
2629
1620
63167
54.00
1.86
0.28
475102
18580
2849
936
0.37
2808
3744
1000000
539889
18580
2849
2656
421929
Sum
[ppm]
10353
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
EEWORLD
