Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ITS4300S-SJ-D
MA001006814
PG-DSO-8-24
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
plastics
inorganic material
organic material
non noble metal
noble metal
noble metal
plastics
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
epoxy resin
silicondioxide
carbon black
tin
silver
silver
epoxy resin
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
-
60676-86-0
1333-86-4
7440-31-5
7440-22-4
7440-22-4
-
Issued
Weight*
Weight
[mg]
1.539
0.009
0.036
0.717
29.121
0.471
4.532
44.632
0.099
0.814
0.650
0.501
0.106
Average
Mass
[%]
1.85
0.01
0.04
0.86
34.99
0.57
5.45
53.62
0.12
0.98
0.78
0.60
0.13
7. May 2015
83.23 mg
Sum
[%]
1.85
Average
Mass
[ppm]
18487
108
431
8617
35.90
0.57
349903
5660
54456
536270
59.19
0.98
0.78
1184
9779
7813
6016
0.73
1276
7292
1000000
591910
9779
7813
359059
5660
Sum
[ppm]
18487
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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