128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 2 MHz |
| Data retention time - minimum | 40 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 4.9 mm |
| memory density | 1024 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 128 words |
| character code | 128 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 128X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | HARDWARE/SOFTWARE |
| ST95011M3 | ST95011M1 | ST95011M1TR | ST95011M6TR | ST95011M3TR | ST95011B6 | ST95011M6 | |
|---|---|---|---|---|---|---|---|
| Description | 128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 128X8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 128X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | DIP | SOIC |
| package instruction | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, | SOP, | SOP, | DIP, DIP8,.3 | SOP, SOP8,.25 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | unknown | not_compliant | _compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| length | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.55 mm | 4.9 mm |
| memory density | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| character code | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | SOP | SOP | DIP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 5.9 mm | 1.75 mm |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| Is it lead-free? | Contains lead | Contains lead | - | - | - | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | - | - | - | incompatible | incompatible |
| Maker | STMicroelectronics | - | - | - | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Data retention time - minimum | 40 | 40 | - | - | - | 40 | 40 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-609 code | e0 | e0 | - | - | - | e0 | e0 |
| Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | - | - | - | DIP8,.3 | SOP8,.25 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | - | - | - | 5 V | 5 V |
| Maximum standby current | 0.00005 A | 0.00005 A | - | - | - | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.002 mA | 0.002 mA | - | - | - | 0.002 mA | 0.002 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
