# - Also rated for operation at 115Vac 400Hz. Self-heating will occur – evaluation in situ recommended
* Recommended values
†
Also available in C0G
Syfer Technology Ltd.
SFKK Issue 2 (P108893) Release Date 04/03/14
Page 2 of 5
1GHz
6
9
12
15
19
20
24
27
30
34
38
41
44
48
51
54
57
60
63
66
68
70
T Configuration
Ferrite Inductance (Typical) – 100nH
0.01MHz
Typical Insertion Loss (db)
Product Code
Capacitance
20% UOS
Dielectric
Rated
Voltage
(dc)
100MHz
0.1MHz
10MHz
1MHz
DWV
(dc)
* SFKKT5000100ZC0
SFKKT5000150ZC0
SFKKT5000220ZC0
SFKKT5000330ZC0
* SFKKT5000470ZC0
* SFKKT5000680MC0
* SFKKT5000101MC0
SFKKT5000151MC0
* SFKKT5000221MC0
* SFKKT5000331MC0
* SFKKT5000471MX0
SFKKT5000681MX0
* SFKKT5000102MX0
SFKKT5000152MX0
* SFKKT5000222MX0
SFKKT5000332MX0
* SFKKT5000472MX0
SFKKT5000682MX0
* SFKKT5000103MX0
* SFKKT5000153MX0
* SFKKT5000223MX0
SFKKT5000333MX0
* SFKKT2000473MX0
SFKKT2000683MX0
*SFKKT1000104MX0
* SFKKT0500154MX0
10pF -20% / +80%
15pF -20% / +80%
22pF -20% / +80%
33pF -20% / +80%
47pF -20% / +80%
68pF
100pF
150pF
220pF
330pF
470pF
680pF
1.0nF
1.5nF
2.2nF
3.3nF
4.7nF
6.8nF
10nF
15nF
22nF
33nF
47nF
68nF
100nF
150nF
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
† X7R
† X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
500#
200
200
100
50
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
750
500
500
250
125
1
2
4
7
1
4
7
10
14
17
20
22
25
1
2
4
7
10
13
17
19
23
26
29
33
36
39
42
46
49
1
2
4
6
9
12
15
19
21
24
28
30
34
38
40
43
45
47
49
50
52
57
62
68
>70
>70
>70
>70
>70
# - Also rated for operation at 115Vac 400Hz. Self-heating will occur – evaluation in situ recommended
* Recommended values
†
Also available in C0G
Ordering Information
Type
SF
Syfer Filter
Case Style
K
4.4mm O.D.
Thread
K
M3.5
Electrical
configuration
T
C = C Filter
L = L-C Filter
T = T Filter
Voltage
(dc)
500
050 = 50V
100 = 100V
200 = 200V
500 = 500V
Capacitance in
picofarads (pF)
0102
First digit is 0. Second and
third digits are significant
figures of capacitance code.
The fourth digit is the number
of zeros following.
Examples: 0101 = 100pF
0332 = 3300pF
Note
1
: Installation tool available on request
Note
2
: The addition of a 4-digit numerical suffix code can be used to denote changes to the standard part.
Options include for example: change of pin length / custom body dimensions or threads / alternative voltage rating / non-standard intermediate capacitance values / test
requirements.
Please refer specific requests to the factory.
Capacitance Tolerance
M
M =
20%
Z = -20+80%
Dielectric
X
C = C0G/NP0
X = X7R
Hardware
0
0 = Without
Syfer Technology Ltd.
SFKK Issue 1 (P107561) Release Date 02/05/13
Page 3 of 5
1GHz
9
11
14
18
20
23
27
30
33
36
40
43
47
50
53
57
59
63
66
68
70
Surface Mount and Panel Mount Solder-in filters
Solder pad layouts are included with the detailed information
for each part.
Recommended soldering profile
E01, E03, E07 SBSP ranges are compatible with all standard
solder types including lead-free, maximum temperature
260°C. For SBSG, SBSM and SFSS ranges, solder time should
be minimised, and the temperature controlled to a maximum
of 220°C. For SFSR, SFST and SFSU ranges the maximum
temperature is 250°C.
Cooling to ambient temperature should be allowed to occur
naturally. Natural cooling allows a gradual relaxation of
thermal mismatch stresses in the solder joints. Draughts
should be avoided. Forced air cooling can induce thermal
breakage, and cleaning with cold fluids immediately after a
soldering process may result in cracked filters.
Note: The use of FlexiCap™ terminations is strongly
recommended to reduce the risk of mechanical cracking.
Soldering to axial wire leads
Soldering temperature
The tip temperature of the iron should not exceed 300°C.
Dwell time
Soldering of filters
The soldering process should be controlled such that the filter
does not experience any thermal shocks which may induce
thermal cracks in the ceramic dielectric.
The pre-heat temperature rise of the filter should be kept to
around 2°C per second. In practice successful temperature
rises tend to be in the region of 1.5°C to 4°C per second
dependent upon substrate and components.
The introduction of a soak after pre-heat can be useful as it
allows temperature uniformity to be established across the
substrate thus preventing substrate warping. The magnitude
or direction of any warping may change on cooling imposing
damaging stresses upon the filter.
Dwell time should be 3-5 seconds maximum to minimise the
risk of cracking the capacitor due to thermal shock.
Heat sink
Where possible, a heat sink should be used between the solder
joint and the body, especially if longer dwell times are
required.
Bending or cropping of wire leads
Bending or cropping of the filter terminations should not be
carried out within 4mm (0.157”) of the epoxy encapsulation,
the wire should be supported when cropping.
Soldering irons should not be used for mounting surface
mount filters as they can result in thermal shock
damage to the chip capacitor.
A more comprehensive application note covering
installation of all Syfer products is available on the Syfer
website.
Syfer Technology Ltd.
SFKK Issue 1 (P107561) Release Date 02/05/13
Page 4 of 5
Resin filled screw mounted EMI filters
General
The ceramic capacitor, which is the heart of the filter, can be
damaged by thermal and mechanical shock, as well as by
over-voltage. Care should be taken to minimise the risk of
stress when mounting the filter to a panel and when soldering
wire to the filter terminations.
Mounting to chassis
Mounting torque
It is important to mount the filter to the bulkhead or panel
using the recommended mounting torque, otherwise damage
may be caused to the capacitor due to distortion of the case.
When a threaded hole is to be utilised, the maximum mounting
torque should be 50% of the specified figure which relates to
unthreaded holes. For details of torque figures for each filter
range, please see below.
Torque (max.)
Thread
M2.5 & 4-40 UNC
M3
6-32 UNC
M3.5
M4 & 8-32 UNC
M5, 12-32 UNEF & 2BA
M6 & 1/4-28 UNF
With nut
-
0.25Nm (2.21lbf in)
0.3Nm (2.65lbf in)
0.35Nm (3.09lbf in)
0.5Nm (4.42lbf in)
0.6Nm (5.31lbf in)
0.9Nm (7.97lbf in)
Into tapped hole
0.15Nm (1.32lbf in)
0.15Nm (1.32lbf in)
0.15Nm (1.32lbf in)
0.18Nm (1.59lbf in)
0.25Nm (2.21lbf in)
0.3Nm (2.65lbf in)
-
Grounding
To ensure the proper operation of the filters, the filter body
should be adequately grounded to the panel to allow an
effective path for the interference. The use of locking
adhesives is not recommended, but if used should be applied
after the filter has been fitted.
Minimum plate thickness
Users should be aware that the majority of these filters have
an undercut between the thread and the mounting flange of
the body, equal to 1.5 x the pitch of the thread. Mounting into
a panel thinner than this undercut length may result in
problems with thread mating and filter position. It is
recommended that a panel thicker than this undercut length be
used wherever possible.
Maximum plate thickness
This is specified for each filter in order that the nut can be fully
engaged even when using a washer.
Soldering to axial wire leads
Soldering temperature
The tip temperature of the iron should not exceed 300°C.
Dwell time
Dwell time should be 3-5 seconds maximum to minimise the
risk of cracking the capacitor due to thermal shock.
Heat sink
Where possible, a heat sink should be used between the solder
joint and the body, especially if longer dwell times are
required.
Bending or cropping of wire leads
Bending or cropping of the filter terminations should not be
carried out within 4mm (0.157”) of the epoxy encapsulation,
the wire should be supported when cropping.
RoHS compliance
All surface mount filters, resin sealed panel mount filters and
power filters are fully RoHS compliant through material
exemption, although care must be taken not to exceed the
maximum soldering temperatures of surface mount parts.
Standard hermetic sealed panel mount filters use SnPb solders
as part of their assembly, and are intended for exempt
applications such as aerospace or military. Substitution of the
SnPb solder with Pb free solders is possible to create a RoHS
compliant part – please contact factory for further details.
Tools
Hexagonal devices should be assembled using a suitable
socket. Round bodied filters may be fitted to the panel in one
of two ways (and should not be fitted using pliers or other
similar tools which may damage them):
Round bodies with slotted tops are designed to be screwed
in using a simple purpose-designed tool.
Round bodies without slotted tops are intended to be
inserted into slotted holes and retained with a nut.
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